The global flexible PCB market is expected to reach $33 billion USD by 2024, growing at a CAGR of 10.6% between 2015 and 2024. The Asian production capacity dominates and serves the rest of the world market.
10.6% compound annual growth rate (CAGR)
As demand for Printed Circuit Board and Flexible Printed Circuit Boards grow, so do sourcing issues.
Causes of sourcing issues
- Component shortages
- Increasing prices of raw materials
- Trade conflicts
- Logistical complexity
- Covid-19 disruption
A PCB shortage can lead to
- Longer lead and production times
- Decreased production
- Declining revenue
with Chemical wet etching for Flex-PCB production
Secure the sourcing with in-house PCB production
With Dry Phase Patterning, you can secure and shorten the Flex-PCB production process by bringing it in-house. This speeds up prototyping and production while removing an entire step from your supply chain and simplify the logistics.
Quality materials from Avery Dennison
With the DPP technology you can use various types of flex foil materials for example Al (aluminum), Cu (copper) or (CCA) Copper Cladded Aluminum as top layer. The Copper Skin from Avery Dennison Hanita is an excellent (CCA) material for sustainable products in the DPP 360 machine. Copper Skin give the cost advantages of aluminum foil with the trouble-free connectivity of copper in this innovative combination of the two.